Micron Technology - MT45W2MW16BGB-708AT

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MT45W2MW16BGB-708AT by Micron Technology

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Manufacturer Micron Technology
Manufacturer's Part Number MT45W2MW16BGB-708AT
Description SRAMs; Temperature Grade: INDUSTRIAL; No. of Terminals: 54; Package Code: FBGA; Package Shape: RECTANGULAR; Maximum Access Time: 70 ns;
Datasheet MT45W2MW16BGB-708AT Datasheet
In Stock368
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Standby Current: .00011 Amp
Organization: 2MX16
Output Characteristics: 3-STATE
Sub-Category: Other Memory ICs
Surface Mount: YES
Maximum Supply Current: 35 mA
Terminal Finish: MATTE TIN
No. of Terminals: 54
No. of Words: 2097152 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, FINE PITCH
Technology: CMOS
JESD-30 Code: R-PBGA-B54
Package Shape: RECTANGULAR
Terminal Form: BALL
Maximum Operating Temperature: 105 Cel
Package Code: FBGA
Moisture Sensitivity Level (MSL): 1
Input/Output Type: COMMON
Memory Density: 33554432 bit
JESD-609 Code: e3
Minimum Operating Temperature: -40 Cel
Memory Width: 16
Qualification: Not Qualified
Package Equivalence Code: BGA54,6X9,30
Maximum Access Time: 70 ns
No. of Words Code: 2M
Terminal Pitch: .75 mm
Temperature Grade: INDUSTRIAL
Power Supplies (V): 1.8,1.8/3.3
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