Micron Technology - MT45W4MW16BFB-706WTES

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MT45W4MW16BFB-706WTES by Micron Technology

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Manufacturer Micron Technology
Manufacturer's Part Number MT45W4MW16BFB-706WTES
Description Other Memory ICs; No. of Terminals: 54; Package Code: FBGA; Package Shape: RECTANGULAR; Input/Output Type: COMMON; Terminal Form: BALL;
Datasheet MT45W4MW16BFB-706WTES Datasheet
In Stock1,581
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Standby Current: .00012 Amp
Organization: 4MX16
Output Characteristics: 3-STATE
Sub-Category: Other Memory ICs
Surface Mount: YES
Maximum Supply Current: 30 mA
No. of Terminals: 54
No. of Words: 4194304 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, FINE PITCH
Technology: CMOS
JESD-30 Code: R-PBGA-B54
Package Shape: RECTANGULAR
Terminal Form: BALL
Package Code: FBGA
Input/Output Type: COMMON
Memory Density: 67108864 bit
Memory Width: 16
Qualification: Not Qualified
Package Equivalence Code: BGA54,6X9,30
Maximum Access Time: 70 ns
No. of Words Code: 4M
Terminal Pitch: .75 mm
Power Supplies (V): 1.8,1.8/3
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