Micron Technology - MT47H512M4THN-3:H

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MT47H512M4THN-3:H by Micron Technology

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Manufacturer Micron Technology
Manufacturer's Part Number MT47H512M4THN-3:H
Description DDR2 DRAM; Temperature Grade: OTHER; No. of Terminals: 63; Package Code: FBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
Datasheet MT47H512M4THN-3:H Datasheet
In Stock2,329
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Standby Current: .014 Amp
Organization: 512MX4
Output Characteristics: 3-STATE
Maximum Time At Peak Reflow Temperature (s): 30
Sub-Category: DRAMs
Surface Mount: YES
Maximum Supply Current: 192 mA
No. of Terminals: 63
Maximum Clock Frequency (fCLK): 333 MHz
No. of Words: 536870912 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, FINE PITCH
Technology: CMOS
JESD-30 Code: R-PBGA-B63
Package Shape: RECTANGULAR
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: FBGA
Input/Output Type: COMMON
Memory Density: 2147483648 bit
Memory IC Type: DDR2 DRAM
Minimum Operating Temperature: 0 Cel
Memory Width: 4
Qualification: Not Qualified
Package Equivalence Code: BGA63,9X11,32
Refresh Cycles: 8192
No. of Words Code: 512M
Nominal Supply Voltage / Vsup (V): 1.8
Peak Reflow Temperature (C): 260
Terminal Pitch: .8 mm
Temperature Grade: OTHER
Power Supplies (V): 1.8
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