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| Manufacturer | Micron Technology |
|---|---|
| Manufacturer's Part Number | MT49H16M18SJ-25 |
| Description | RLDRAM2; No. of Terminals: 144; Package Code: TBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR; Maximum Time At Peak Reflow Temperature (s): 30; |
| Datasheet | MT49H16M18SJ-25 Datasheet |
| In Stock | 1,007 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Standby Current: | .288 Amp |
| Organization: | 16MX18 |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Maximum Seated Height: | 1.2 mm |
| Access Mode: | MULTI BANK PAGE BURST |
| Minimum Supply Voltage (Vsup): | 1.7 V |
| Surface Mount: | YES |
| Maximum Supply Current: | 408 mA |
| Terminal Finish: | TIN SILVER COPPER |
| No. of Terminals: | 144 |
| Maximum Clock Frequency (fCLK): | 400 MHz |
| No. of Words: | 16777216 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, THIN PROFILE |
| Technology: | CMOS |
| JESD-30 Code: | R-PBGA-B144 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Operating Mode: | SYNCHRONOUS |
| Maximum Operating Temperature: | 95 Cel |
| Package Code: | TBGA |
| Width: | 11 mm |
| Input/Output Type: | COMMON |
| No. of Ports: | 1 |
| Memory Density: | 301989888 bit |
| Self Refresh: | NO |
| Sequential Burst Length: | 2,4,8 |
| Memory IC Type: | RLDRAM2 |
| JESD-609 Code: | e1 |
| Minimum Operating Temperature: | 0 Cel |
| Memory Width: | 18 |
| No. of Functions: | 1 |
| Package Equivalence Code: | BGA144,12X18,40/32 |
| Refresh Cycles: | 8192 |
| Interleaved Burst Length: | 2,4,8 |
| Length: | 18.5 mm |
| No. of Words Code: | 16M |
| Nominal Supply Voltage / Vsup (V): | 1.8 |
| Additional Features: | AUTO REFRESH, TERM PITCH-MAX |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | 1 mm |
| Maximum Supply Voltage (Vsup): | 1.9 V |
