Micron Technology - MT49H32M18CBM-33

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MT49H32M18CBM-33 by Micron Technology

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Manufacturer Micron Technology
Manufacturer's Part Number MT49H32M18CBM-33
Description DDR DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 144; Package Code: BGA; Package Shape: RECTANGULAR; No. of Words: 33554432 words;
Datasheet MT49H32M18CBM-33 Datasheet
In Stock1,559
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Standby Current: .048 Amp
Organization: 32MX18
Output Characteristics: 3-STATE
Sub-Category: DRAMs
Surface Mount: YES
Maximum Supply Current: 819 mA
No. of Terminals: 144
Maximum Clock Frequency (fCLK): 300 MHz
No. of Words: 33554432 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Technology: CMOS
JESD-30 Code: R-PBGA-B144
Package Shape: RECTANGULAR
Terminal Form: BALL
Maximum Operating Temperature: 70 Cel
Package Code: BGA
Input/Output Type: SEPARATE
Memory Density: 603979776 bit
Sequential Burst Length: 2,4,8
Memory IC Type: DDR DRAM
Minimum Operating Temperature: 0 Cel
Memory Width: 18
Qualification: Not Qualified
Package Equivalence Code: BGA144,12X18,40/32
Interleaved Burst Length: 2,4,8
Maximum Access Time: .25 ns
No. of Words Code: 32M
Terminal Pitch: .8 mm
Temperature Grade: COMMERCIAL
Power Supplies (V): 1.5/1.8,1.8,2.5
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