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| Manufacturer | Micron Technology |
|---|---|
| Manufacturer's Part Number | MT52L256M64D2PP-107WT:B |
| Description | LPDDR3 DRAM; Temperature Grade: OTHER; No. of Terminals: 216; Package Code: VFBGA; Package Shape: SQUARE; Organization: 256MX64; |
| Datasheet | MT52L256M64D2PP-107WT:B Datasheet |
| In Stock | 105 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Organization: | 256MX64 |
| Output Characteristics: | COMMON |
| Maximum Seated Height: | .8 mm |
| Access Mode: | SINGLE BANK PAGE BURST |
| Minimum Supply Voltage (Vsup): | 1.14 V |
| Surface Mount: | YES |
| No. of Terminals: | 216 |
| No. of Words: | 268435456 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B216 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Operating Mode: | SYNCHRONOUS |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | VFBGA |
| Width: | 12 mm |
| Input/Output Type: | CONFIGURABLE |
| No. of Ports: | 1 |
| Memory Density: | 17179869184 bit |
| Self Refresh: | YES |
| Memory IC Type: | LPDDR3 DRAM |
| Minimum Operating Temperature: | -30 Cel |
| Memory Width: | 64 |
| No. of Functions: | 1 |
| Package Equivalence Code: | BGA216,12X12,16 |
| Length: | 12 mm |
| No. of Words Code: | 256M |
| Nominal Supply Voltage / Vsup (V): | 1.2 |
| Additional Features: | AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOM |
| Terminal Pitch: | .4 mm |
| Temperature Grade: | OTHER |
| Maximum Supply Voltage (Vsup): | 1.3 V |
| Reverse Pinout: | NO |
