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Manufacturer | Micron Technology |
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Manufacturer's Part Number | MT53D1024M32D4DT-046AAT:D |
Description | LPDDR4 DRAM; No. of Terminals: 200; Package Code: VFBGA; Package Shape: RECTANGULAR; Terminal Pitch: .8 mm; Access Mode: MULTI BANK PAGE BURST; |
In Stock | 466 |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Organization: | 1GX32 |
Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
Maximum Seated Height: | .95 mm |
Access Mode: | MULTI BANK PAGE BURST |
Minimum Supply Voltage (Vsup): | 1.06 V |
Surface Mount: | YES |
No. of Terminals: | 200 |
Maximum Clock Frequency (fCLK): | 2136.7 MHz |
No. of Words: | 1073741824 words |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
Screening Level: | AEC-Q100 |
Technology: | CMOS |
JESD-30 Code: | R-PBGA-B200 |
Package Shape: | RECTANGULAR |
Terminal Form: | BALL |
Operating Mode: | SYNCHRONOUS |
Maximum Operating Temperature: | 105 Cel |
Package Code: | VFBGA |
Width: | 10 mm |
Input/Output Type: | COMMON |
No. of Ports: | 1 |
Memory Density: | 34359738368 bit |
Self Refresh: | YES |
Sequential Burst Length: | 16,32 |
Memory IC Type: | LPDDR4 DRAM |
Minimum Operating Temperature: | -40 Cel |
Memory Width: | 32 |
No. of Functions: | 1 |
Package Equivalence Code: | BGA200,12X22,32/25 |
Interleaved Burst Length: | 16,32 |
Length: | 14.5 mm |
No. of Words Code: | 1G |
Nominal Supply Voltage / Vsup (V): | 1.1 |
Additional Features: | SELF REFRESH; IT ALSO REQUIRES 1.8V NOM; TERM PITCH-MAX |
Peak Reflow Temperature (C): | NOT SPECIFIED |
Terminal Pitch: | .8 mm |
Maximum Supply Voltage (Vsup): | 1.17 V |