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| Manufacturer | Micron Technology |
|---|---|
| Manufacturer's Part Number | MT53E512M64D2HJ-046WT:B |
| Description | LPDDR4 DRAM; No. of Terminals: 556; Package Code: TFBGA; Package Shape: SQUARE; Terminal Form: BALL; Technology: CMOS; |
| Datasheet | MT53E512M64D2HJ-046WT:B Datasheet |
| In Stock | 1,529 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Organization: | 512MX64 |
| Maximum Seated Height: | 1.1 mm |
| Access Mode: | MULTI BANK PAGE BURST |
| Minimum Supply Voltage (Vsup): | 1.06 V |
| Surface Mount: | YES |
| No. of Terminals: | 556 |
| Maximum Clock Frequency (fCLK): | 2136.7 MHz |
| No. of Words: | 536870912 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, THIN PROFILE, FINE PITCH |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B556 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Operating Mode: | SYNCHRONOUS |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | TFBGA |
| Width: | 12.4 mm |
| Input/Output Type: | COMMON |
| No. of Ports: | 1 |
| Memory Density: | 34359738368 bit |
| Self Refresh: | YES |
| Sequential Burst Length: | 16,32 |
| Memory IC Type: | LPDDR4 DRAM |
| Minimum Operating Temperature: | -25 Cel |
| Memory Width: | 64 |
| No. of Functions: | 1 |
| Package Equivalence Code: | BGA556,29X29,16 |
| Interleaved Burst Length: | 16,32 |
| Length: | 12.4 mm |
| No. of Words Code: | 512M |
| Nominal Supply Voltage / Vsup (V): | 1.1 |
| Additional Features: | SELF REFRESH; IT ALSO REQUIRES 1.8V NOM |
| Terminal Pitch: | .4 mm |
| Maximum Supply Voltage (Vsup): | 1.17 V |
