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| Manufacturer | Micron Technology |
|---|---|
| Manufacturer's Part Number | MT53E768M64D4HJ-046AIT:A |
| Description | LPDDR4 DRAM; No. of Terminals: 556; Package Code: TFBGA; Package Shape: SQUARE; Minimum Operating Temperature: -40 Cel; Package Body Material: PLASTIC/EPOXY; |
| Datasheet | MT53E768M64D4HJ-046AIT:A Datasheet |
| In Stock | 2,052 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Standby Current: | .0032 Amp |
| Organization: | 768MX64 |
| Output Characteristics: | 3-STATE |
| Maximum Seated Height: | 1.1 mm |
| Access Mode: | MULTI BANK PAGE BURST |
| Minimum Supply Voltage (Vsup): | 1.06 V |
| Surface Mount: | YES |
| Maximum Supply Current: | 320 mA |
| No. of Terminals: | 556 |
| Maximum Clock Frequency (fCLK): | 2133 MHz |
| No. of Words: | 805306368 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, THIN PROFILE, FINE PITCH |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B556 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Operating Mode: | SYNCHRONOUS |
| Maximum Operating Temperature: | 95 Cel |
| Package Code: | TFBGA |
| Width: | 12.4 mm |
| Input/Output Type: | COMMON |
| No. of Ports: | 1 |
| Memory Density: | 51539607552 bit |
| Self Refresh: | YES |
| Sequential Burst Length: | 16,32 |
| Memory IC Type: | LPDDR4 DRAM |
| Minimum Operating Temperature: | -40 Cel |
| Memory Width: | 64 |
| No. of Functions: | 1 |
| Package Equivalence Code: | BGA556,29X29,16 |
| Interleaved Burst Length: | 16,32 |
| Length: | 12.4 mm |
| Maximum Access Time: | 3.5 ns |
| No. of Words Code: | 768M |
| Nominal Supply Voltage / Vsup (V): | 1.1 |
| Terminal Pitch: | .4 mm |
| Maximum Supply Voltage (Vsup): | 1.17 V |
