Micron Technology - MT54W2MH18BF-7.5

MT54W2MH18BF-7.5 by Micron Technology

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Manufacturer Micron Technology
Manufacturer's Part Number MT54W2MH18BF-7.5
Description QDR SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 165; Package Code: TBGA; Package Shape: RECTANGULAR; Organization: 2MX18;
Datasheet MT54W2MH18BF-7.5 Datasheet
In Stock1,934
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 2MX18
Maximum Seated Height: 1.2 mm
Minimum Supply Voltage (Vsup): 1.7 V
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
No. of Terminals: 165
No. of Words: 2097152 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, THIN PROFILE
Technology: CMOS
JESD-30 Code: R-PBGA-B165
Package Shape: RECTANGULAR
Terminal Form: BALL
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 70 Cel
Package Code: TBGA
Width: 15 mm
Memory Density: 37748736 bit
Memory IC Type: QDR SRAM
JESD-609 Code: e1
Minimum Operating Temperature: 0 Cel
Memory Width: 18
No. of Functions: 1
Qualification: Not Qualified
Length: 17 mm
Maximum Access Time: .5 ns
No. of Words Code: 2M
Nominal Supply Voltage / Vsup (V): 1.8
Additional Features: PIPELINED ARCHITECTURE
Parallel or Serial: PARALLEL
Terminal Pitch: 1 mm
Temperature Grade: COMMERCIAL
Maximum Supply Voltage (Vsup): 1.9 V
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Pricing (USD)

Qty. Unit Price Ext. Price
1,934 - -

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