Micron Technology - MT55L64L32P1F-10

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MT55L64L32P1F-10 by Micron Technology

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Manufacturer Micron Technology
Manufacturer's Part Number MT55L64L32P1F-10
Description ZBT SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 165; Package Code: TBGA; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 3.465 V;
Datasheet MT55L64L32P1F-10 Datasheet
In Stock934
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Standby Current: .01 Amp
Organization: 64KX32
Output Characteristics: 3-STATE
Maximum Seated Height: 1.2 mm
Minimum Supply Voltage (Vsup): 3.135 V
Sub-Category: SRAMs
Surface Mount: YES
Maximum Supply Current: 225 mA
Terminal Finish: Tin/Lead (Sn/Pb)
No. of Terminals: 165
No. of Words: 65536 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, THIN PROFILE
Technology: CMOS
JESD-30 Code: R-PBGA-B165
Package Shape: RECTANGULAR
Terminal Form: BALL
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 70 Cel
Package Code: TBGA
Width: 13 mm
Input/Output Type: COMMON
Memory Density: 2097152 bit
Minimum Standby Voltage: 3.14 V
Memory IC Type: ZBT SRAM
JESD-609 Code: e0
Minimum Operating Temperature: 0 Cel
Memory Width: 32
No. of Functions: 1
Qualification: Not Qualified
Package Equivalence Code: BGA165,11X15,40
Length: 15 mm
Maximum Access Time: 5 ns
No. of Words Code: 64K
Nominal Supply Voltage / Vsup (V): 3.3
Parallel or Serial: PARALLEL
Terminal Pitch: 1 mm
Temperature Grade: COMMERCIAL
Maximum Supply Voltage (Vsup): 3.465 V
Power Supplies (V): 3.3
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Pricing (USD)

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