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| Manufacturer | Micron Technology |
|---|---|
| Manufacturer's Part Number | MT55V256V72F11G |
| Description | ZBT SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 221; Package Code: TFBGA; Package Shape: RECTANGULAR; Width: 13 mm; |
| Datasheet | MT55V256V72F11G Datasheet |
| In Stock | 1,314 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Organization: | 256KX72 |
| Maximum Seated Height: | 1.2 mm |
| Minimum Supply Voltage (Vsup): | 2.375 V |
| Surface Mount: | YES |
| Terminal Finish: | TIN SILVER COPPER |
| No. of Terminals: | 221 |
| No. of Words: | 262144 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, THIN PROFILE, FINE PITCH |
| Technology: | CMOS |
| JESD-30 Code: | R-PBGA-B221 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Operating Mode: | SYNCHRONOUS |
| Maximum Operating Temperature: | 70 Cel |
| Package Code: | TFBGA |
| Width: | 13 mm |
| Memory Density: | 18874368 bit |
| Memory IC Type: | ZBT SRAM |
| JESD-609 Code: | e1 |
| Minimum Operating Temperature: | 0 Cel |
| Memory Width: | 72 |
| No. of Functions: | 1 |
| Qualification: | Not Qualified |
| Length: | 15 mm |
| Maximum Access Time: | 8.5 ns |
| No. of Words Code: | 256K |
| Nominal Supply Voltage / Vsup (V): | 2.5 |
| Parallel or Serial: | PARALLEL |
| Terminal Pitch: | .8 mm |
| Temperature Grade: | COMMERCIAL |
| Maximum Supply Voltage (Vsup): | 2.625 V |
