MT55V256V72P-10H by Micron Technology | Memory ICs

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Manufacturer	Micron Technology
Manufacturer's Part Number	MT55V256V72P-10H
Description	ZBT SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 209; Package Code: BGA; Package Shape: RECTANGULAR; Terminal Pitch: 1 mm;
Datasheet	MT55V256V72P-10H Datasheet
In Stock	1,383

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Organization:	256KX72
Maximum Seated Height:	2.2 mm
Minimum Supply Voltage (Vsup):	2.375 V
Surface Mount:	YES
Terminal Finish:	TIN SILVER COPPER
No. of Terminals:	209
No. of Words:	262144 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY
Technology:	CMOS
JESD-30 Code:	R-PBGA-B209
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Operating Mode:	SYNCHRONOUS
Maximum Operating Temperature:	70 Cel
Package Code:	BGA
Width:	14 mm
Memory Density:	18874368 bit
Memory IC Type:	ZBT SRAM
JESD-609 Code:	e1
Minimum Operating Temperature:	0 Cel
Memory Width:	72
No. of Functions:	1
Qualification:	Not Qualified
Length:	22 mm
Maximum Access Time:	5 ns
No. of Words Code:	256K
Nominal Supply Voltage / Vsup (V):	2.5
Parallel or Serial:	PARALLEL
Terminal Pitch:	1 mm
Temperature Grade:	COMMERCIAL
Maximum Supply Voltage (Vsup):	2.625 V

Pricing (USD)

Qty.	Unit Price	Ext. Price
1,383	-	-

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