
Image shown is a representation only.
Manufacturer | Micron Technology |
---|---|
Manufacturer's Part Number | MT57V256H36PF-4 |
Description | DDR SRAM; No. of Terminals: 165; Package Code: TBGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY; Maximum Supply Voltage (Vsup): 2.6 V; |
Datasheet | MT57V256H36PF-4 Datasheet |
In Stock | 1,436 |
NAME | DESCRIPTION |
---|---|
Package Body Material: | PLASTIC/EPOXY |
Maximum Standby Current: | .075 Amp |
Organization: | 256KX36 |
Output Characteristics: | 3-STATE |
Maximum Seated Height: | 1.2 mm |
Minimum Supply Voltage (Vsup): | 2.4 V |
Sub-Category: | SRAMs |
Surface Mount: | YES |
Maximum Supply Current: | 450 mA |
Terminal Finish: | Tin/Lead (Sn/Pb) |
No. of Terminals: | 165 |
Maximum Clock Frequency (fCLK): | 250 MHz |
No. of Words: | 262144 words |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, THIN PROFILE |
Technology: | CMOS |
JESD-30 Code: | R-PBGA-B165 |
Package Shape: | RECTANGULAR |
Terminal Form: | BALL |
Operating Mode: | SYNCHRONOUS |
Package Code: | TBGA |
Width: | 13 mm |
Input/Output Type: | COMMON |
Memory Density: | 9437184 bit |
Minimum Standby Voltage: | 2.4 V |
Memory IC Type: | DDR SRAM |
JESD-609 Code: | e0 |
Memory Width: | 36 |
No. of Functions: | 1 |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA165,11X15,40 |
Length: | 15 mm |
Maximum Access Time: | 2.2 ns |
No. of Words Code: | 256K |
Nominal Supply Voltage / Vsup (V): | 2.5 |
Parallel or Serial: | PARALLEL |
Terminal Pitch: | 1 mm |
Maximum Supply Voltage (Vsup): | 2.6 V |
Power Supplies (V): | 1.5,2.5 |