Micron Technology - MT57W2MH8CF-7.5

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MT57W2MH8CF-7.5 by Micron Technology

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Manufacturer Micron Technology
Manufacturer's Part Number MT57W2MH8CF-7.5
Description DDR SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 165; Package Code: TBGA; Package Shape: RECTANGULAR; Input/Output Type: SEPARATE;
Datasheet MT57W2MH8CF-7.5 Datasheet
In Stock2,395
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Standby Current: .125 Amp
Organization: 2MX8
Output Characteristics: 3-STATE
Maximum Seated Height: 1.2 mm
Minimum Supply Voltage (Vsup): 1.7 V
Sub-Category: SRAMs
Surface Mount: YES
Maximum Supply Current: 235 mA
Terminal Finish: Tin/Lead (Sn/Pb)
No. of Terminals: 165
Maximum Clock Frequency (fCLK): 133 MHz
No. of Words: 2097152 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, THIN PROFILE
Technology: CMOS
JESD-30 Code: R-PBGA-B165
Package Shape: RECTANGULAR
Terminal Form: BALL
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 70 Cel
Package Code: TBGA
Width: 13 mm
Input/Output Type: SEPARATE
Memory Density: 16777216 bit
Minimum Standby Voltage: 1.7 V
Memory IC Type: DDR SRAM
JESD-609 Code: e0
Minimum Operating Temperature: 0 Cel
Memory Width: 8
No. of Functions: 1
Qualification: Not Qualified
Package Equivalence Code: BGA165,11X15,40
Length: 15 mm
Maximum Access Time: .5 ns
No. of Words Code: 2M
Nominal Supply Voltage / Vsup (V): 1.8
Additional Features: PIPELINED ARCHITECTURE
Parallel or Serial: PARALLEL
Terminal Pitch: 1 mm
Temperature Grade: COMMERCIAL
Maximum Supply Voltage (Vsup): 1.9 V
Power Supplies (V): 1.5/1.8,1.8
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Pricing (USD)

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