Micron Technology - MT58V1MV32DF-6

MT58V1MV32DF-6 by Micron Technology

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Manufacturer Micron Technology
Manufacturer's Part Number MT58V1MV32DF-6
Description STANDARD SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 165; Package Code: TBGA; Package Shape: RECTANGULAR; Operating Mode: SYNCHRONOUS;
Datasheet MT58V1MV32DF-6 Datasheet
In Stock103
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 1MX32
Maximum Seated Height: 1.2 mm
Minimum Supply Voltage (Vsup): 2.375 V
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
No. of Terminals: 165
No. of Words: 1048576 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, THIN PROFILE
Technology: CMOS
JESD-30 Code: R-PBGA-B165
Package Shape: RECTANGULAR
Terminal Form: BALL
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 70 Cel
Package Code: TBGA
Width: 15 mm
Memory Density: 33554432 bit
Memory IC Type: STANDARD SRAM
JESD-609 Code: e1
Minimum Operating Temperature: 0 Cel
Memory Width: 32
No. of Functions: 1
Qualification: Not Qualified
Length: 17 mm
Maximum Access Time: 3.5 ns
No. of Words Code: 1M
Nominal Supply Voltage / Vsup (V): 2.5
Additional Features: PIPELINED ARCHITECTURE
Parallel or Serial: PARALLEL
Terminal Pitch: 1 mm
Temperature Grade: COMMERCIAL
Maximum Supply Voltage (Vsup): 2.625 V
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