Micron Technology - MT5C256K16B2TG15XT

Analog Devices' DS1204U-G4C is a 256-bit MEMORY CIRCUIT with CMOS technology. Operating at 5V, it has a 256X1 organization and operates SYNCHRONOUSLY up to 70 °C. Ideal for applications requiring reliable memory storage in COMMERCIAL-grade environments.

Other Memory ICs;

SN74AS870JTP4 by Texas Instruments is a TTL technology IC with 24 terminals in an IN-LINE package. It operates b/w 0-70°C, suitable for commercial applications. The ceramic package body and rectangular shape make it ideal for various memory functions.

MEMORY CIRCUIT; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Memory Width: 8; JESD-30 Code: R-PDSO-N8;

Intel's SSDSCKJB150G7 is a CMOS memory circuit with 150GX8 organization and 1288490188800 bit memory density. Operating in ASYNCHRONOUS mode, it has a temperature range of 0-70 °C, suitable for commercial applications requiring high-speed data storage.

M36W216BI70ZA6 from STMicroelectronics is a low-profile, asynchronous memory IC featuring 16Mbit density with FLASH+SRAM technology. It operates b/w -40 °C to 85 °C and requires a supply voltage of 2.7V to 3.3V. Ideal for industrial applications, it offers fast access times of 70ns.

SNC54LS170W by Texas Instruments is a MIL-STD-883 Class B (Modified) rated TTL IC with 16 terminals and a supply voltage of 5V. Its ceramic package can operate b/w -55°C to 125°C, making it suitable for military-grade applications requiring reliable memory functions in harsh environments. This rectangular flatpack IC is surface mountable and ideal for use in rugged electronic systems where high temperature tolerance and durability are essential.

Other Memory ICs;

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 4; Package Code: SOP; Package Shape: RECTANGULAR; No. of Functions: 1;

47L16-E/SN by Microchip Technology is a small outline memory IC with 2Kx8 organization, EEPROM+SRAM mixed memory type, and synchronous operating mode. It is suitable for automotive applications due to its CMOS technology, -40 to 125 °C temperature range, and compact rectangular package shape.

Other Memory ICs; Peak Reflow Temperature (C): 260; Terminal Finish: Matte Tin (Sn) - annealed; Moisture Sensitivity Level (MSL): 1; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 30;

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Width: 3.9 mm;

MEMORY CIRCUIT;

Intel's SSDSA2BW160G3 is a MICROELECTRONIC ASSEMBLY with 160GX8 organization, CMOS technology, and 1374389534720 bit memory density. It operates in ASYNCHRONOUS mode at temperatures from 0 to 70 °C, suitable for commercial applications requiring high-speed memory ICs.

Other Memory ICs;

TMS2708JL by Texas Instruments is a 1KX8 OTP ROM memory IC with 8192-bit density and 450ns access time. It operates b/w 0-70°C, featuring a MOS technology in a ceramic rectangular package. Ideal for applications requiring fast data retrieval and storage in commercial-grade environments.

Other Memory ICs;

MEMORY CIRCUIT; Moisture Sensitivity Level (MSL): 3;

STMicroelectronics M36W108T100ZM5T is a 1MX8 memory IC with 1048576 words and 8388608 bit memory density. It operates in asynchronous mode, has a supply voltage range of 2.7V to 3.6V, and is suitable for applications requiring low profile grid array packages.

Other Memory ICs;