Micron Technology - MT62F1G32D4DS-031AAT:B

  1. Home
  2. Micron Technology - MT62F1G32D4DS-031AAT:B
MT62F1G32D4DS-031AAT:B by Micron Technology

Image shown is a representation only.

Manufacturer Micron Technology
Manufacturer's Part Number MT62F1G32D4DS-031AAT:B
Description LPDDR5 DRAM;
Datasheet MT62F1G32D4DS-031AAT:B Datasheet
In Stock2,022
Plant 5!
Your quote plants 5 trees.

Pricing (USD)

Qty. Unit Price Ext. Price
2,022 $56.442 $114,125.724

Popular Products

Category Top Products

MT48LC4M16A2B4-6AIT:J by Micron Technology

MT48LC4M16A2B4-6AIT:J

Micron Technology

Micron Technology's MT48LC4M16A2B4-6AIT:J is a 4MX16 Synchronous DRAM with 3.3V supply, operating at 167MHz. It features a very thin profile grid array package and supports common I/O type. Ideal for industrial applications requiring fast access times and low power consumption.
EBJ40UG8EFU5-GNL-F by Micron Technology

EBJ40UG8EFU5-GNL-F

Micron Technology

Micron Technology's EBJ40UG8EFU5-GNL-F is a 512MX64 DDR DRAM MODULE with 64-bit memory width. Operating at 1.35V, it offers synchronous mode and self-refresh capability. Ideal for commercial applications, this rectangular package has 204 terminals and supports single bank page burst access mode.
IS42S16400J-7TLI by Integrated Silicon Solution

IS42S16400J-7TLI

Integrated Silicon Solution

IS42S16400J-7TLI by Integrated Silicon Solution is a 4MX16 Synchronous DRAM with 16-bit memory width. It operates at 143 MHz clock frequency, has 4096 refresh cycles, and supports common I/O type. Ideal for industrial applications requiring fast data access and reliable performance in a compact package.
K4S641632H-UC75 by Samsung

K4S641632H-UC75

Samsung

Samsung's K4S641632H-UC75 is a 3.3V DRAM with 4MX16 organization, 133 MHz clock frequency, and 70°C operating temperature. Ideal for applications requiring high-speed memory access in commercial-grade devices.
MT48LC8M16A2TG-7E by Micron Technology

MT48LC8M16A2TG-7E

Micron Technology

Micron Technology's MT48LC8M16A2TG-7E is a 3.3V Synchronous DRAM with 8MX16 organization, operating at up to 143 MHz clock frequency. It features common I/O type, self-refresh mode, and 4096 refresh cycles. Ideal for commercial applications requiring fast memory access and low power consumption.
IS42S32400F-6TL-TR by Integrated Silicon Solution

IS42S32400F-6TL-TR

Integrated Silicon Solution

IS42S32400F-6TL-TR by Integrated Silicon Solution is a 3.3V DRAM with 4MX32 organization, operating at 166 MHz. It features a small outline package and is suitable for applications requiring high-speed memory access in commercial temperature environments.
MT48LC16M16A2P-6A by Micron Technology

MT48LC16M16A2P-6A

Micron Technology

MT48LC16M16A2P-6A by Micron Technology is a 16MX16 DRAM with 167 MHz clock frequency, 5.4 ns access time, and 8192 refresh cycles. It is used in commercial applications requiring synchronous memory ICs with a memory density of 268435456 bits.
W3H32M64E-533SBI by Mercury Systems

W3H32M64E-533SBI

Mercury Systems

DDR2 DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 208; Package Code: BGA; Package Shape: RECTANGULAR; JESD-30 Code: R-PBGA-B208;
MT41K512M8DA-107IT:P by Micron Technology

MT41K512M8DA-107IT:P

Micron Technology

MT41K512M8DA-107IT:P by Micron Technology is a DDR3L DRAM with 512Mx8 organization, operating at 1.35V. It features synchronous mode, self-refresh capability, and multi-bank page burst access. Ideal for applications requiring high memory density and fast access times in a compact form factor.
IS43R16320D-6TLI by Integrated Silicon Solution

IS43R16320D-6TLI

Integrated Silicon Solution

IS43R16320D-6TLI by Integrated Silicon Solution is a 32MX16 DDR1 DRAM with 166 MHz clock frequency. Operating at 2.5V, it offers a memory density of 536870912 bits for industrial applications. Featuring synchronous operation and self-refresh capability, this DRAM has a small outline package style ideal for common I/O types.
KM44C256BZ-8 by Samsung

KM44C256BZ-8

Samsung

Samsung's KM44C256BZ-8 is a 256Kx4 DRAM with 80ns access time, operating at 5V. It features a common I/O type, 3-state output characteristics, and fast page access mode. Ideal for commercial applications requiring high-speed memory with a memory density of 1048576 bits.
M12L2561616A-6TG2A by Elite Semiconductor Microelectronics Technologyinc

M12L2561616A-6TG2A

Elite Semiconductor Microelectronics Technologyinc

M12L2561616A-6TG2A by Elite Semiconductor is a 16MX16 Synchronous DRAM with a memory density of 268435456 bit. It operates at a nominal voltage of 3.3V and has a max access time of 5.4 ns. This memory IC is commonly used in applications that require high-speed data storage and retrieval, such as computer systems and networking devices.
MT53D1024M32D4DT-053WT:D by Micron Technology

MT53D1024M32D4DT-053WT:D

Micron Technology

Micron Technology's MT53D1024M32D4DT-053WT:D is a LPDDR4 DRAM with 1GX32 organization, operating at up to 1869.1 MHz clock frequency. It features dual bank page burst access mode and common I/O type, suitable for applications requiring high-speed synchronous memory with low power consumption.
AS4C4M16SA-6BIN by Alliance Memory

AS4C4M16SA-6BIN

Alliance Memory

Alliance Memory's AS4C4M16SA-6BIN is a 3.3V, 4MX16 Synchronous DRAM with 5.4ns access time. Ideal for industrial applications, it features self-refresh mode, operates at -40 to 85°C, and has a memory density of 67108864 bits.
S27KS0642GABHI023 by Infineon Technologies

S27KS0642GABHI023

Infineon Technologies

Infineon's S27KS0642GABHI023 DRAM features 8MX8 organization, 200 MHz clock frequency, and 67108864 bit memory density. Ideal for applications requiring high-speed synchronous operation in a compact form factor with low power consumption.
MT46H64M16LFBF-5AIT:B by Micron Technology

MT46H64M16LFBF-5AIT:B

Micron Technology

Micron Technology's MT46H64M16LFBF-5AIT:B is a 64MX16 DDR1 DRAM with 67108864 words. It operates at 200 MHz, has a memory density of 1073741824 bit, and supports a max clock frequency of 200 MHz. Ideal for industrial applications requiring fast data access and high memory capacity.
HX316LS9IBK2/8 by Kingston Technology Company

HX316LS9IBK2/8

Kingston Technology Company

Kingston's HX316LS9IBK2/8 DDR3L DRAM Module has 512MX64 organization, operates at 1.35V, and offers a memory width of 64 bits. Ideal for applications requiring high-speed synchronous operation in microelectronic assemblies with dual terminals and multi-bank page burst access mode.
MT48LC8M16A2B4-6AIT:L by Micron Technology

MT48LC8M16A2B4-6AIT:L

Micron Technology

Micron Technology's MT48LC8M16A2B4-6AIT:L is a 3.3V Synchronous DRAM with 8MX16 organization, operating at 167 MHz clock frequency. It features self-refresh capability and offers a memory density of 134217728 bits. Ideal for industrial applications requiring fast access times and low standby current consumption.
MT46V64M8P-5B:J by Micron Technology

MT46V64M8P-5B:J

Micron Technology

Micron Technology's MT46V64M8P-5B:J is a DDR1 DRAM with 64MX8 organization, operating at 200 MHz. It features synchronous operation, self-refresh capability, and common I/O type. Ideal for applications requiring high-speed memory access in commercial temperature environments.
K4S561632E-TC75 by Samsung

K4S561632E-TC75

Samsung

Samsung's K4S561632E-TC75 is a 16MX16 DRAM with 3.3V supply, operating at 133MHz clock frequency. It features synchronous operation, self-refresh capability, and common I/O type. Ideal for applications requiring high-speed memory access in commercial temperature environments.