Micron Technology - MT6V16M18F2-3C

MT6V16M18F2-3C by Micron Technology

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Manufacturer Micron Technology
Manufacturer's Part Number MT6V16M18F2-3C
Description RAMBUS DRAM; No. of Terminals: 84; Package Code: BGA; Package Shape: RECTANGULAR; Memory Width: 18; Terminal Form: BALL;
Datasheet MT6V16M18F2-3C Datasheet
In Stock874
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 16MX18
Access Mode: BLOCK ORIENTED PROTOCOL
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
No. of Terminals: 84
No. of Words: 16777216 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Technology: CMOS
JESD-30 Code: R-PBGA-B84
Package Shape: RECTANGULAR
Terminal Form: BALL
Operating Mode: SYNCHRONOUS
Package Code: BGA
No. of Ports: 1
Memory Density: 301989888 bit
Self Refresh: YES
Memory IC Type: RAMBUS DRAM
JESD-609 Code: e1
Memory Width: 18
No. of Functions: 1
Qualification: Not Qualified
No. of Words Code: 16M
Nominal Supply Voltage / Vsup (V): 2.5
Additional Features: SELF CONTAINED REFRESH
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Pricing (USD)

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