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| Manufacturer | Micron Technology |
|---|---|
| Manufacturer's Part Number | MT75W16Y136HBB-100 |
| Description | CONTENT ADDRESSABLE SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 272; Package Code: BGA; Package Shape: SQUARE; Alternate Memory Width: 136; |
| Datasheet | MT75W16Y136HBB-100 Datasheet |
| In Stock | 2,076 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Organization: | 8KX272 |
| Maximum Seated Height: | 2.46 mm |
| Minimum Supply Voltage (Vsup): | 1.7 V |
| Sub-Category: | SRAMs |
| Surface Mount: | YES |
| Terminal Finish: | TIN LEAD |
| No. of Terminals: | 272 |
| No. of Words: | 8192 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B272 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Operating Mode: | SYNCHRONOUS |
| Maximum Operating Temperature: | 70 Cel |
| Package Code: | BGA |
| Width: | 27 mm |
| Memory Density: | 2228224 bit |
| Memory IC Type: | CONTENT ADDRESSABLE SRAM |
| JESD-609 Code: | e0 |
| Minimum Operating Temperature: | 0 Cel |
| Memory Width: | 272 |
| No. of Functions: | 1 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA272,20X20,50 |
| Alternate Memory Width: | 136 |
| Length: | 27 mm |
| No. of Words Code: | 8K |
| Nominal Supply Voltage / Vsup (V): | 1.8 |
| Additional Features: | PIPELINED ARCHITECTURE; ALSO CONFIGURABLE AS 32K X 68 |
| Parallel or Serial: | PARALLEL |
| Terminal Pitch: | 1.27 mm |
| Temperature Grade: | COMMERCIAL |
| Maximum Supply Voltage (Vsup): | 1.9 V |
| Power Supplies (V): | 1.8,3.3 |
