Micron Technology - MTA18ASF2G72HBZ-3G2XX

MTA18ASF2G72HBZ-3G2XX by Micron Technology

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Manufacturer Micron Technology
Manufacturer's Part Number MTA18ASF2G72HBZ-3G2XX
Description DDR4 DRAM MODULE; No. of Terminals: 260; Package Code: DIMM; Package Shape: RECTANGULAR; Width: 3.7 mm; Maximum Clock Frequency (fCLK): 1600 MHz;
Datasheet MTA18ASF2G72HBZ-3G2XX Datasheet
In Stock349
NAME DESCRIPTION
Package Body Material: UNSPECIFIED
Organization: 2GX72
Maximum Seated Height: 30.15 mm
Access Mode: DUAL BANK PAGE BURST
Surface Mount: NO
No. of Terminals: 260
Maximum Clock Frequency (fCLK): 1600 MHz
No. of Words: 2147483648 words
Terminal Position: ZIG-ZAG
Package Style (Meter): MICROELECTRONIC ASSEMBLY
Technology: CMOS
JESD-30 Code: R-XZMA-N260
Package Shape: RECTANGULAR
Terminal Form: NO LEAD
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 105 Cel
Package Code: DIMM
Width: 3.7 mm
No. of Ports: 1
Memory Density: 154618822656 bit
Self Refresh: YES
Memory IC Type: DDR4 DRAM MODULE
Minimum Operating Temperature: -40 Cel
Memory Width: 72
No. of Functions: 1
Length: 69.6 mm
No. of Words Code: 2G
Nominal Supply Voltage / Vsup (V): 1.2
Additional Features: AUTO/SELF REFRESH; WD-MAX
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