MTFC64GJXEF-WT by Micron Technology | Memory ICs

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Manufacturer	Micron Technology
Manufacturer's Part Number	MTFC64GJXEF-WT
Description	Embedded MMC; No. of Terminals: 169; Package Code: TFBGA; Package Shape: RECTANGULAR; Terminal Form: BALL; Technology: CMOS;
Datasheet	MTFC64GJXEF-WT Datasheet
In Stock	968

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Organization:	64GX8
Output Characteristics:	OPEN-DRAIN
Maximum Seated Height:	1.2 mm
Programming Voltage (V):	1.8
Minimum Supply Voltage (Vsup):	1.65 V
Surface Mount:	YES
Maximum Supply Current:	80 mA
No. of Terminals:	169
Maximum Clock Frequency (fCLK):	52 MHz
No. of Words:	68719476736 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Write Protection:	HARDWARE
Technology:	CMOS
JESD-30 Code:	R-PBGA-B169
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Operating Mode:	SYNCHRONOUS
Maximum Operating Temperature:	85 Cel
Package Code:	TFBGA
Width:	14 mm
Memory Density:	549755813888 bit
Memory IC Type:	Embedded MMC
Minimum Operating Temperature:	-25 Cel
Memory Width:	8
No. of Functions:	1
Type:	NAND TYPE
Package Equivalence Code:	BGA169,14X28,20
Length:	18 mm
No. of Words Code:	64G
Nominal Supply Voltage / Vsup (V):	1.8
Terminal Pitch:	.5 mm
Maximum Supply Voltage (Vsup):	1.95 V

Pricing (USD)

Qty.	Unit Price	Ext. Price
968	-	-

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N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Package Style (Meter): SMALL OUTLINE; No. of Terminals: 3;