MTFDCAE001SAF-1B1 by Micron Technology | Memory ICs

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Manufacturer	Micron Technology
Manufacturer's Part Number	MTFDCAE001SAF-1B1
Description	FLASH MODULE; Temperature Grade: COMMERCIAL; Package Code: XMA; Package Shape: RECTANGULAR; Package Body Material: UNSPECIFIED; Width: 26.6 mm;
Datasheet	MTFDCAE001SAF-1B1 Datasheet
In Stock	902

NAME	DESCRIPTION
Package Body Material:	UNSPECIFIED
Maximum Standby Current:	.06 Amp
Organization:	1GX8
Maximum Seated Height:	9.7 mm
Programming Voltage (V):	5
Minimum Supply Voltage (Vsup):	4.75 V
Surface Mount:	NO
Maximum Supply Current:	120 mA
No. of Words:	1073741824 words
Terminal Position:	UNSPECIFIED
Package Style (Meter):	MICROELECTRONIC ASSEMBLY
Technology:	CMOS
JESD-30 Code:	R-XXMA-X
Package Shape:	RECTANGULAR
Terminal Form:	UNSPECIFIED
Operating Mode:	ASYNCHRONOUS
Maximum Operating Temperature:	70 Cel
Package Code:	XMA
Width:	26.6 mm
Memory Density:	8589934592 bit
Memory IC Type:	FLASH MODULE
Minimum Operating Temperature:	0 Cel
Memory Width:	8
No. of Functions:	1
Type:	SLC NAND TYPE
Length:	36.9 mm
No. of Words Code:	1G
Nominal Supply Voltage / Vsup (V):	5
Parallel or Serial:	SERIAL
Temperature Grade:	COMMERCIAL
Maximum Supply Voltage (Vsup):	5.25 V

Pricing (USD)

Qty.	Unit Price	Ext. Price
902	-	-

TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;

NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Power Dissipation (Abs): 1 W; Maximum Collector Current (IC): .8 A; Terminal Form: WIRE;

MAGNETIC FIELD SENSOR,HALL EFFECT; Mounting Feature: THROUGH HOLE MOUNT; No. of Terminals: 3; Output Type: ANALOG CURRENT; Package Shape or Style: RECTANGULAR; Output Range: 25mA;

TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: THROUGH HOLE MOUNT; No. of Terminals: 3; Package Shape or Style: RECTANGULAR; Maximum Operating Current: 1.5 mA; Package Equivalence Code: SIP3,.1,50;

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