Micron Technology - MTFDCAE008SAF-1C3

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MTFDCAE008SAF-1C3 by Micron Technology

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Manufacturer Micron Technology
Manufacturer's Part Number MTFDCAE008SAF-1C3
Description FLASH MODULE; Temperature Grade: COMMERCIAL; Package Code: XMA; Package Shape: RECTANGULAR; Length: 36.9 mm; Type: SLC NAND TYPE;
Datasheet MTFDCAE008SAF-1C3 Datasheet
In Stock374
NAME DESCRIPTION
Package Body Material: UNSPECIFIED
Maximum Standby Current: .06 Amp
Organization: 8GX8
Maximum Seated Height: 9.7 mm
Programming Voltage (V): 5
Minimum Supply Voltage (Vsup): 4.75 V
Surface Mount: NO
Maximum Supply Current: 120 mA
No. of Words: 8589934592 words
Terminal Position: UNSPECIFIED
Package Style (Meter): MICROELECTRONIC ASSEMBLY
Technology: CMOS
JESD-30 Code: R-XXMA-X
Package Shape: RECTANGULAR
Terminal Form: UNSPECIFIED
Operating Mode: ASYNCHRONOUS
Maximum Operating Temperature: 70 Cel
Package Code: XMA
Width: 26.6 mm
Memory Density: 68719476736 bit
Memory IC Type: FLASH MODULE
Minimum Operating Temperature: 0 Cel
Memory Width: 8
No. of Functions: 1
Type: SLC NAND TYPE
Length: 36.9 mm
No. of Words Code: 8G
Nominal Supply Voltage / Vsup (V): 5
Parallel or Serial: SERIAL
Temperature Grade: COMMERCIAL
Maximum Supply Voltage (Vsup): 5.25 V
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