Micron Technology - MTFDDAK032SBD-1AH12ITYY

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MTFDDAK032SBD-1AH12ITYY by Micron Technology

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Manufacturer Micron Technology
Manufacturer's Part Number MTFDDAK032SBD-1AH12ITYY
Description FLASH MODULE; Temperature Grade: INDUSTRIAL; No. of Terminals: 22; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel; Memory Width: 8;
Datasheet MTFDDAK032SBD-1AH12ITYY Datasheet
In Stock1,540
NAME DESCRIPTION
Package Body Material: UNSPECIFIED
Organization: 32GX8
Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED
Maximum Seated Height: 7.2 mm
Programming Voltage (V): 5
Minimum Supply Voltage (Vsup): 4.5 V
Surface Mount: NO
No. of Terminals: 22
No. of Words: 34359738368 words
Terminal Position: SINGLE
Package Style (Meter): MICROELECTRONIC ASSEMBLY
Technology: CMOS
JESD-30 Code: R-XSMA-X22
Package Shape: RECTANGULAR
Terminal Form: UNSPECIFIED
Maximum Operating Temperature: 85 Cel
Width: 69.85 mm
Memory Density: 274877906944 bit
Memory IC Type: FLASH MODULE
Minimum Operating Temperature: -40 Cel
Memory Width: 8
No. of Functions: 1
Type: SLC NAND TYPE
Length: 100.45 mm
No. of Words Code: 32G
Nominal Supply Voltage / Vsup (V): 5
Additional Features: LENGTH_MAX
Peak Reflow Temperature (C): NOT SPECIFIED
Parallel or Serial: PARALLEL
Temperature Grade: INDUSTRIAL
Maximum Supply Voltage (Vsup): 5.5 V
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