Micron Technology - MTFDHBE1T9TDF-1AW12ABYY

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MTFDHBE1T9TDF-1AW12ABYY by Micron Technology

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Manufacturer Micron Technology
Manufacturer's Part Number MTFDHBE1T9TDF-1AW12ABYY
Description FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; JESD-30 Code: R-XXMA-N; Memory Density: 16888498602639 bit; Technology: CMOS;
Datasheet MTFDHBE1T9TDF-1AW12ABYY Datasheet
In Stock304
NAME DESCRIPTION
Other Names: 557-MTFDHBE1T9TDF-1AW12ABYY
Package Body Material: UNSPECIFIED
Memory Density: 16888498602639 bit
Organization: 1.92TX8
Surface Mount: YES
Memory IC Type: FLASH MODULE
Minimum Operating Temperature: 0 Cel
Memory Width: 8
No. of Functions: 1
Type: TLC NAND TYPE
No. of Words: 2111062325329 words
Terminal Position: UNSPECIFIED
Package Style (Meter): MICROELECTRONIC ASSEMBLY
Technology: CMOS
No. of Words Code: 1.92T
JESD-30 Code: R-XXMA-N
Package Shape: RECTANGULAR
Terminal Form: NO LEAD
Operating Mode: ASYNCHRONOUS
Maximum Operating Temperature: 70 Cel
Package Code: XMA
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