MTFDHBE3T2TDG-1AW4ZABYY by Micron Technology | Memory ICs

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Manufacturer	Micron Technology
Manufacturer's Part Number	MTFDHBE3T2TDG-1AW4ZABYY
Description	FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; Memory Density: 28147497671065 bit; Technology: CMOS; Package Body Material: UNSPECIFIED;
Datasheet	MTFDHBE3T2TDG-1AW4ZABYY Datasheet
In Stock	2,379

NAME	DESCRIPTION
Package Body Material:	UNSPECIFIED
Memory Density:	28147497671065 bit
Organization:	3.2TX8
Surface Mount:	YES
Memory IC Type:	FLASH MODULE
Minimum Operating Temperature:	0 Cel
Memory Width:	8
No. of Functions:	1
Type:	TLC NAND TYPE
No. of Words:	3518437208883 words
Terminal Position:	UNSPECIFIED
Package Style (Meter):	MICROELECTRONIC ASSEMBLY
Technology:	CMOS
No. of Words Code:	3.2T
JESD-30 Code:	R-XXMA-N
Package Shape:	RECTANGULAR
Terminal Form:	NO LEAD
Operating Mode:	ASYNCHRONOUS
Maximum Operating Temperature:	70 Cel
Package Code:	XMA

Pricing (USD)

Qty.	Unit Price	Ext. Price
2,379	-	-

OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;

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