Image shown is a representation only.
| Manufacturer | Micron Technology |
|---|---|
| Manufacturer's Part Number | MTFDHBK512TDP-1AT12AIYY |
| Description | FLASH MODULE; Temperature Grade: INDUSTRIAL; Package Shape: RECTANGULAR; Package Body Material: UNSPECIFIED; Package Style (Meter): MICROELECTRONIC ASSEMBLY; Maximum Operating Temperature: 95 Cel; |
| Datasheet | MTFDHBK512TDP-1AT12AIYY Datasheet |
| In Stock | 536 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | UNSPECIFIED |
| Memory Density: | 4398046511104 bit |
| Organization: | 512GX8 |
| Surface Mount: | NO |
| Memory IC Type: | FLASH MODULE |
| Minimum Operating Temperature: | -40 Cel |
| Memory Width: | 8 |
| No. of Functions: | 1 |
| Type: | TLC NAND TYPE |
| No. of Words: | 549755813888 words |
| Terminal Position: | SINGLE |
| Package Style (Meter): | MICROELECTRONIC ASSEMBLY |
| Technology: | CMOS |
| No. of Words Code: | 512G |
| JESD-30 Code: | R-XSMA-N |
| Package Shape: | RECTANGULAR |
| Terminal Form: | NO LEAD |
| Operating Mode: | ASYNCHRONOUS |
| Maximum Operating Temperature: | 95 Cel |
| Temperature Grade: | INDUSTRIAL |








