
Image shown is a representation only.
Manufacturer | Micron Technology |
---|---|
Manufacturer's Part Number | MTFDHBL512TDP-1AT12AIYY |
Description | FLASH MODULE; Temperature Grade: INDUSTRIAL; Package Shape: RECTANGULAR; Technology: CMOS; Peak Reflow Temperature (C): 260; Terminal Finish: TIN SILVER COPPER; |
Datasheet | MTFDHBL512TDP-1AT12AIYY Datasheet |
In Stock | 1,593 |
NAME | DESCRIPTION |
---|---|
Package Body Material: | UNSPECIFIED |
Memory Density: | 4398046511104 bit |
Organization: | 512GX8 |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Surface Mount: | YES |
Memory IC Type: | FLASH MODULE |
Terminal Finish: | TIN SILVER COPPER |
JESD-609 Code: | e1 |
Minimum Operating Temperature: | -40 Cel |
Memory Width: | 8 |
No. of Functions: | 1 |
Type: | TLC NAND TYPE |
No. of Words: | 549755813888 words |
Terminal Position: | BOTTOM |
Technology: | CMOS |
No. of Words Code: | 512G |
JESD-30 Code: | R-XBGA-B |
Package Shape: | RECTANGULAR |
Terminal Form: | BALL |
Operating Mode: | ASYNCHRONOUS |
Maximum Operating Temperature: | 95 Cel |
Peak Reflow Temperature (C): | 260 |
Temperature Grade: | INDUSTRIAL |