Micron Technology - MTFDHBL512TDP-1AT12AIYY

MTFDHBL512TDP-1AT12AIYY by Micron Technology

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Manufacturer Micron Technology
Manufacturer's Part Number MTFDHBL512TDP-1AT12AIYY
Description FLASH MODULE; Temperature Grade: INDUSTRIAL; Package Shape: RECTANGULAR; Technology: CMOS; Peak Reflow Temperature (C): 260; Terminal Finish: TIN SILVER COPPER;
Datasheet MTFDHBL512TDP-1AT12AIYY Datasheet
In Stock1,593
NAME DESCRIPTION
Package Body Material: UNSPECIFIED
Memory Density: 4398046511104 bit
Organization: 512GX8
Maximum Time At Peak Reflow Temperature (s): 30
Surface Mount: YES
Memory IC Type: FLASH MODULE
Terminal Finish: TIN SILVER COPPER
JESD-609 Code: e1
Minimum Operating Temperature: -40 Cel
Memory Width: 8
No. of Functions: 1
Type: TLC NAND TYPE
No. of Words: 549755813888 words
Terminal Position: BOTTOM
Technology: CMOS
No. of Words Code: 512G
JESD-30 Code: R-XBGA-B
Package Shape: RECTANGULAR
Terminal Form: BALL
Operating Mode: ASYNCHRONOUS
Maximum Operating Temperature: 95 Cel
Peak Reflow Temperature (C): 260
Temperature Grade: INDUSTRIAL
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Pricing (USD)

Qty. Unit Price Ext. Price
1,593 $123.690 $197,038.170

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