Micron Technology - MTFDHBM1T0TDQ-1AT12ATYY

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MTFDHBM1T0TDQ-1AT12ATYY by Micron Technology

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Manufacturer Micron Technology
Manufacturer's Part Number MTFDHBM1T0TDQ-1AT12ATYY
Description FLASH MODULE; Temperature Grade: INDUSTRIAL; Package Shape: RECTANGULAR; Type: TLC NAND TYPE; JESD-30 Code: R-XBGA-B; Terminal Position: BOTTOM;
Datasheet MTFDHBM1T0TDQ-1AT12ATYY Datasheet
In Stock33
NAME DESCRIPTION
Package Body Material: UNSPECIFIED
Memory Density: 8796093022208 bit
Organization: 1TX8
Surface Mount: YES
Memory IC Type: FLASH MODULE
Minimum Operating Temperature: -40 Cel
Memory Width: 8
No. of Functions: 1
Type: TLC NAND TYPE
No. of Words: 1099511627776 words
Terminal Position: BOTTOM
Technology: CMOS
No. of Words Code: 1T
JESD-30 Code: R-XBGA-B
Package Shape: RECTANGULAR
Terminal Form: BALL
Operating Mode: ASYNCHRONOUS
Maximum Operating Temperature: 105 Cel
Temperature Grade: INDUSTRIAL
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