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| Manufacturer | Micron Technology |
|---|---|
| Manufacturer's Part Number | MTFDKCC960TFR-1BC1ZABYY |
| Description | FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; Type: TLC NAND TYPE; Terminal Form: UNSPECIFIED; JESD-30 Code: R-XXMA-X; |
| Datasheet | MTFDKCC960TFR-1BC1ZABYY Datasheet |
| In Stock | 14 |
| NAME | DESCRIPTION |
|---|---|
| Other Names: | 557-MTFDKCC960TFR-1BC1ZABYY |
| Package Body Material: | UNSPECIFIED |
| Memory Density: | 8246337208320 bit |
| Organization: | 960GX8 |
| Surface Mount: | NO |
| Memory IC Type: | FLASH MODULE |
| Minimum Operating Temperature: | 0 Cel |
| Memory Width: | 8 |
| No. of Functions: | 1 |
| Type: | TLC NAND TYPE |
| No. of Words: | 1030792151040 words |
| Terminal Position: | UNSPECIFIED |
| Package Style (Meter): | MICROELECTRONIC ASSEMBLY |
| Technology: | CMOS |
| No. of Words Code: | 960G |
| JESD-30 Code: | R-XXMA-X |
| Package Shape: | RECTANGULAR |
| Terminal Form: | UNSPECIFIED |
| Maximum Operating Temperature: | 70 Cel |
| Package Code: | XMA |







