Micron Technology - N25Q064A33E12DFG

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N25Q064A33E12DFG by Micron Technology

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Manufacturer Micron Technology
Manufacturer's Part Number N25Q064A33E12DFG
Description FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 24; Package Code: BGA; Package Shape: SQUARE; Serial Bus Type: SPI;
Datasheet N25Q064A33E12DFG Datasheet
In Stock1,794
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Standby Current: .0001 Amp
Organization: 8MX8
Sub-Category: Flash Memories
Surface Mount: YES
Maximum Supply Current: 20 mA
No. of Terminals: 24
Maximum Clock Frequency (fCLK): 108 MHz
No. of Words: 8388608 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Write Protection: HARDWARE/SOFTWARE
Technology: CMOS
JESD-30 Code: S-PBGA-B24
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Endurance: 100000 Write/Erase Cycles
Package Code: BGA
Serial Bus Type: SPI
Memory Density: 67108864 bit
Memory IC Type: FLASH
Minimum Operating Temperature: -40 Cel
Memory Width: 8
Type: NOR TYPE
Qualification: Not Qualified
Package Equivalence Code: BGA24,5X5,40
No. of Words Code: 8M
Minimum Data Retention Time: 20
Parallel or Serial: SERIAL
Terminal Pitch: 1 mm
Temperature Grade: INDUSTRIAL
Power Supplies (V): 3/3.3
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