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Manufacturer | Micron Technology |
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Manufacturer's Part Number | NAND01GW4A2CZD6F |
Description | FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 55; Package Code: TFBGA; Package Shape: RECTANGULAR; Maximum Operating Temperature: 85 Cel; |
Datasheet | NAND01GW4A2CZD6F Datasheet |
In Stock | 954 |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Organization: | 64MX16 |
Maximum Seated Height: | 1.05 mm |
Programming Voltage (V): | 3 |
Minimum Supply Voltage (Vsup): | 2.7 V |
Surface Mount: | YES |
No. of Terminals: | 55 |
No. of Words: | 67108864 words |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY |
Technology: | CMOS |
JESD-30 Code: | R-PBGA-B55 |
Package Shape: | RECTANGULAR |
Terminal Form: | BALL |
Operating Mode: | SYNCHRONOUS |
Maximum Operating Temperature: | 85 Cel |
Package Code: | TFBGA |
Width: | 8 mm |
Memory Density: | 1073741824 bit |
Memory IC Type: | FLASH |
Minimum Operating Temperature: | -40 Cel |
Memory Width: | 16 |
No. of Functions: | 1 |
Type: | SLC NAND TYPE |
Qualification: | Not Qualified |
Length: | 10 mm |
Maximum Access Time: | 12000 ns |
No. of Words Code: | 64M |
Nominal Supply Voltage / Vsup (V): | 3 |
Additional Features: | ORGANIZED AS 264 PAGES OF 528 BYTES |
Parallel or Serial: | PARALLEL |
Terminal Pitch: | .8 mm |
Temperature Grade: | INDUSTRIAL |
Maximum Supply Voltage (Vsup): | 3.6 V |