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| Manufacturer | Micron Technology |
|---|---|
| Manufacturer's Part Number | NAND08GAH0BZA5F |
| Description | Other Memory ICs; Temperature Grade: OTHER; No. of Terminals: 169; Package Code: FBGA; Package Shape: RECTANGULAR; Surface Mount: YES; |
| Datasheet | NAND08GAH0BZA5F Datasheet |
| In Stock | 1,213 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Memory Density: | 8589934592 bit |
| Sub-Category: | Other Memory ICs |
| Surface Mount: | YES |
| Minimum Operating Temperature: | -25 Cel |
| No. of Terminals: | 169 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA169,14X28,20 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, FINE PITCH |
| Technology: | CMOS |
| JESD-30 Code: | R-PBGA-B169 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | FBGA |
| Terminal Pitch: | .5 mm |
| Temperature Grade: | OTHER |
| Power Supplies (V): | 1.8/3,3 |
