NAND08GW3C2BZL6F by Micron Technology | Memory ICs

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Manufacturer	Micron Technology
Manufacturer's Part Number	NAND08GW3C2BZL6F
Description	FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 52; Package Code: LGA; Surface Mount: YES; Organization: 512MX8;
Datasheet	NAND08GW3C2BZL6F Datasheet
In Stock	506

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Maximum Standby Current:	.00005 Amp
Organization:	512MX8
Sub-Category:	Flash Memories
Surface Mount:	YES
Maximum Supply Current:	30 mA
Command User Interface:	YES
No. of Terminals:	52
No. of Words:	536870912 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY
Technology:	CMOS
No. of Sectors/Size:	2K
Terminal Form:	NO LEAD
Maximum Operating Temperature:	85 Cel
Package Code:	LGA
Memory Density:	4294967296 bit
Sector Size (Words):	256K
Toggle Bit:	NO
Memory IC Type:	FLASH
Minimum Operating Temperature:	-40 Cel
Memory Width:	8
Page Size (words):	2K
Type:	MLC NAND TYPE
Qualification:	Not Qualified
Package Equivalence Code:	LGA52(UNSPEC)
Maximum Access Time:	20 ns
No. of Words Code:	512M
Ready or Busy:	YES
Parallel or Serial:	PARALLEL
Temperature Grade:	INDUSTRIAL
Data Polling:	NO
Power Supplies (V):	3/3.3

Pricing (USD)

Qty.	Unit Price	Ext. Price
506	-	-

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