Micron Technology - NAND16GAH0HZA5F

NAND16GAH0HZA5F by Micron Technology

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Manufacturer Micron Technology
Manufacturer's Part Number NAND16GAH0HZA5F
Description Other Memory ICs; Temperature Grade: OTHER; No. of Terminals: 169; Package Code: FBGA; Package Shape: RECTANGULAR; Maximum Supply Current: 150 mA;
Datasheet NAND16GAH0HZA5F Datasheet
In Stock1,906
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Memory Density: 17179869184 bit
Sub-Category: Other Memory ICs
Surface Mount: YES
Maximum Supply Current: 150 mA
Minimum Operating Temperature: -25 Cel
No. of Terminals: 169
Qualification: Not Qualified
Package Equivalence Code: BGA169,14X28,20
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, FINE PITCH
Technology: CMOS
JESD-30 Code: R-PBGA-B169
Package Shape: RECTANGULAR
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: FBGA
Terminal Pitch: .5 mm
Temperature Grade: OTHER
Power Supplies (V): 1.8/3.3,3.3
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