Micron Technology - NAND16GAH0PZA5F

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NAND16GAH0PZA5F by Micron Technology

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Manufacturer Micron Technology
Manufacturer's Part Number NAND16GAH0PZA5F
Description FLASH; Temperature Grade: OTHER; No. of Terminals: 169; Package Code: LFBGA; Package Shape: RECTANGULAR; Terminal Pitch: .5 mm;
Datasheet NAND16GAH0PZA5F Datasheet
In Stock276
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 2GX8
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Seated Height: 1.4 mm
Programming Voltage (V): 3.3
Minimum Supply Voltage (Vsup): 3.135 V
Surface Mount: YES
Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)
No. of Terminals: 169
No. of Words: 2147483648 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH
Technology: CMOS
JESD-30 Code: R-PBGA-B169
Package Shape: RECTANGULAR
Terminal Form: BALL
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 85 Cel
Package Code: LFBGA
Width: 12 mm
Memory Density: 17179869184 bit
Memory IC Type: FLASH
JESD-609 Code: e1
Minimum Operating Temperature: -25 Cel
Memory Width: 8
No. of Functions: 1
Qualification: Not Qualified
Length: 16 mm
No. of Words Code: 2G
Nominal Supply Voltage / Vsup (V): 3.3
Peak Reflow Temperature (C): 245
Parallel or Serial: PARALLEL
Terminal Pitch: .5 mm
Temperature Grade: OTHER
Maximum Supply Voltage (Vsup): 3.465 V
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