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| Manufacturer | Micron Technology |
|---|---|
| Manufacturer's Part Number | NAND16GW3B6DPA6F |
| Description | FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 114; Package Code: LFBGA; Package Shape: RECTANGULAR; Technology: CMOS; |
| Datasheet | NAND16GW3B6DPA6F Datasheet |
| In Stock | 2,059 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Organization: | 4GX4 |
| Maximum Seated Height: | 1.4 mm |
| Programming Voltage (V): | 3 |
| Minimum Supply Voltage (Vsup): | 2.7 V |
| Surface Mount: | YES |
| No. of Terminals: | 114 |
| No. of Words: | 4294967296 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Technology: | CMOS |
| JESD-30 Code: | R-PBGA-B114 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Operating Mode: | ASYNCHRONOUS |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | LFBGA |
| Width: | 12 mm |
| Memory Density: | 17179869184 bit |
| Memory IC Type: | FLASH |
| Minimum Operating Temperature: | -40 Cel |
| Memory Width: | 4 |
| No. of Functions: | 1 |
| Type: | SLC NAND TYPE |
| Qualification: | Not Qualified |
| Length: | 16 mm |
| Maximum Access Time: | 25 ns |
| No. of Words Code: | 4G |
| Nominal Supply Voltage / Vsup (V): | 3 |
| Parallel or Serial: | PARALLEL |
| Terminal Pitch: | .65 mm |
| Temperature Grade: | INDUSTRIAL |
| Maximum Supply Voltage (Vsup): | 3.6 V |
