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Manufacturer | Micron Technology |
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Manufacturer's Part Number | NAND256W3AACZAXE |
Description | FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 55; Package Code: TFBGA; Package Shape: RECTANGULAR; Type: SLC NAND TYPE; |
Datasheet | NAND256W3AACZAXE Datasheet |
In Stock | 2,420 |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Organization: | 32MX8 |
Maximum Seated Height: | 1.05 mm |
Programming Voltage (V): | 3 |
Minimum Supply Voltage (Vsup): | 2.7 V |
Surface Mount: | YES |
No. of Terminals: | 55 |
No. of Words: | 33554432 words |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, THIN PROFILE, FINE PITCH |
Technology: | CMOS |
JESD-30 Code: | R-PBGA-B55 |
Package Shape: | RECTANGULAR |
Terminal Form: | BALL |
Operating Mode: | ASYNCHRONOUS |
Maximum Operating Temperature: | 85 Cel |
Package Code: | TFBGA |
Width: | 8 mm |
Memory Density: | 268435456 bit |
Memory IC Type: | FLASH |
Minimum Operating Temperature: | -40 Cel |
Memory Width: | 8 |
No. of Functions: | 1 |
Type: | SLC NAND TYPE |
Length: | 10 mm |
No. of Words Code: | 32M |
Nominal Supply Voltage / Vsup (V): | 3 |
Parallel or Serial: | PARALLEL |
Terminal Pitch: | .8 mm |
Temperature Grade: | INDUSTRIAL |
Maximum Supply Voltage (Vsup): | 3.6 V |