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| Manufacturer | Micron Technology |
|---|---|
| Manufacturer's Part Number | NAND512W3A2SZA6E |
| Description | FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 63; Package Code: TFBGA; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 2.7 V; |
| Datasheet | NAND512W3A2SZA6E Datasheet |
| In Stock | 449 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Programming Voltage (V): | 3 |
| Minimum Supply Voltage (Vsup): | 2.7 V |
| Sub-Category: | Flash Memories |
| Surface Mount: | YES |
| Technology: | CMOS |
| No. of Sectors/Size: | 4K |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Operating Mode: | ASYNCHRONOUS |
| Package Code: | TFBGA |
| Toggle Bit: | NO |
| Memory Width: | 8 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA63,10X12,32 |
| Ready or Busy: | YES |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | .8 mm |
| Maximum Standby Current: | .00005 Amp |
| Organization: | 64MX8 |
| Maximum Seated Height: | 1.05 mm |
| Maximum Supply Current: | 20 mA |
| Command User Interface: | YES |
| Terminal Finish: | TIN SILVER COPPER NICKEL |
| No. of Terminals: | 63 |
| No. of Words: | 67108864 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, THIN PROFILE, FINE PITCH |
| JESD-30 Code: | R-PBGA-B63 |
| Maximum Operating Temperature: | 85 Cel |
| Width: | 9 mm |
| Memory Density: | 536870912 bit |
| Sector Size (Words): | 16K |
| Memory IC Type: | FLASH |
| JESD-609 Code: | e2 |
| Minimum Operating Temperature: | -40 Cel |
| Page Size (words): | 512 |
| No. of Functions: | 1 |
| Type: | SLC NAND TYPE |
| Length: | 11 mm |
| Maximum Access Time: | 35 ns |
| No. of Words Code: | 64M |
| Nominal Supply Voltage / Vsup (V): | 3 |
| Parallel or Serial: | PARALLEL |
| Temperature Grade: | INDUSTRIAL |
| Maximum Supply Voltage (Vsup): | 3.6 V |
| Data Polling: | NO |
| Power Supplies (V): | 3/3.3 |
