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| Manufacturer | Micron Technology |
|---|---|
| Manufacturer's Part Number | NANDB9R3N0DZPC5E |
| Description | MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 128; Package Code: FBGA; Package Shape: SQUARE; Terminal Form: BALL; |
| Datasheet | NANDB9R3N0DZPC5E Datasheet |
| In Stock | 835 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Mixed Memory Type: | FLASH+SDRAM |
| Sub-Category: | Other Memory ICs |
| Surface Mount: | YES |
| Memory IC Type: | MEMORY CIRCUIT |
| Minimum Operating Temperature: | -30 Cel |
| No. of Terminals: | 128 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA128,18X18,25 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, FINE PITCH |
| JESD-30 Code: | S-PBGA-B128 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Nominal Supply Voltage / Vsup (V): | 1.8 |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | FBGA |
| Terminal Pitch: | .635 mm |
| Temperature Grade: | OTHER |
| Power Supplies (V): | 1.8 |
