PC28F00BP30EF by Micron Technology | Memory ICs

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Manufacturer	Micron Technology
Manufacturer's Part Number	PC28F00BP30EF
Description	FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: TBGA; Package Shape: RECTANGULAR; No. of Functions: 1;
Datasheet	PC28F00BP30EF Datasheet
In Stock	1,092

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Organization:	128MX16
Maximum Time At Peak Reflow Temperature (s):	30
Maximum Seated Height:	1.2 mm
Programming Voltage (V):	3
Minimum Supply Voltage (Vsup):	1.7 V
Surface Mount:	YES
Terminal Finish:	Tin/Silver/Copper (Sn/Ag/Cu)
No. of Terminals:	64
No. of Words:	134217728 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, THIN PROFILE
Technology:	CMOS
JESD-30 Code:	R-PBGA-B64
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Operating Mode:	SYNCHRONOUS
Maximum Operating Temperature:	85 Cel
Package Code:	TBGA
Width:	8 mm
Memory Density:	2147483648 bit
Memory IC Type:	FLASH
JESD-609 Code:	e1
Minimum Operating Temperature:	-40 Cel
Memory Width:	16
No. of Functions:	1
Type:	NOR TYPE
Qualification:	Not Qualified
Length:	10 mm
Maximum Access Time:	105 ns
No. of Words Code:	128M
Nominal Supply Voltage / Vsup (V):	1.8
Peak Reflow Temperature (C):	260
Parallel or Serial:	PARALLEL
Terminal Pitch:	1 mm
Temperature Grade:	INDUSTRIAL
Maximum Supply Voltage (Vsup):	2 V

Pricing (USD)

Qty.	Unit Price	Ext. Price
1,092	-	-

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