Micron Technology - PC28F256J3D95A

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PC28F256J3D95A by Micron Technology

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Manufacturer Micron Technology
Manufacturer's Part Number PC28F256J3D95A
Description FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES;
Datasheet PC28F256J3D95A Datasheet
In Stock1,926
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Standby Current: .00012 Amp
Organization: 16MX16
Maximum Time At Peak Reflow Temperature (s): 30
Sub-Category: Flash Memories
Surface Mount: YES
Maximum Supply Current: 80 mA
Command User Interface: YES
No. of Terminals: 64
No. of Words: 16777216 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Technology: CMOS
JESD-30 Code: S-PBGA-B64
No. of Sectors/Size: 256
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: BGA
Memory Density: 268435456 bit
Sector Size (Words): 128K
Toggle Bit: NO
Memory IC Type: FLASH
Minimum Operating Temperature: -40 Cel
Memory Width: 16
Page Size (words): 4/8
Type: NOR TYPE
Qualification: Not Qualified
Package Equivalence Code: BGA64,8X8,40
Alternate Memory Width: 8
Common Flash Interface: YES
No. of Words Code: 16M
Ready or Busy: YES
Peak Reflow Temperature (C): 260
Parallel or Serial: PARALLEL
Terminal Pitch: 1 mm
Temperature Grade: INDUSTRIAL
Data Polling: NO
Power Supplies (V): 3/3.3
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