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| Manufacturer | Micron Technology |
|---|---|
| Manufacturer's Part Number | PF38F3360LLYBB0 |
| Description | MEMORY CIRCUIT; No. of Terminals: 103; Package Code: FBGA; Package Shape: RECTANGULAR; Package Equivalence Code: BGA103,9X12,32; Nominal Supply Voltage / Vsup (V): 1.8; |
| Datasheet | PF38F3360LLYBB0 Datasheet |
| In Stock | 1,513 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Standby Current: | .00002 Amp |
| Mixed Memory Type: | FLASH+SDRAM |
| Sub-Category: | Other Memory ICs |
| Surface Mount: | YES |
| Maximum Supply Current: | 80 mA |
| Memory IC Type: | MEMORY CIRCUIT |
| No. of Terminals: | 103 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA103,9X12,32 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, FINE PITCH |
| Maximum Access Time: | 70 ns |
| JESD-30 Code: | R-PBGA-B103 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Nominal Supply Voltage / Vsup (V): | 1.8 |
| Package Code: | FBGA |
| Terminal Pitch: | .8 mm |
| Power Supplies (V): | 1.8 |
