Micron Technology - PF38F4050M0Y3CF

PF38F4050M0Y3CF by Micron Technology

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Manufacturer Micron Technology
Manufacturer's Part Number PF38F4050M0Y3CF
Description MEMORY CIRCUIT; No. of Terminals: 107; Package Code: TQFP; Package Shape: RECTANGULAR; Package Equivalence Code: BGA107,9X12,32; Terminal Form: BALL;
Datasheet PF38F4050M0Y3CF Datasheet
In Stock2,399
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 256MX1
Maximum Seated Height: 1.2 mm
Minimum Supply Voltage (Vsup): 1.7 V
Surface Mount: YES
No. of Terminals: 107
No. of Words: 268435456 words
Terminal Position: BOTTOM
Package Style (Meter): FLATPACK, THIN PROFILE
Technology: CMOS
JESD-30 Code: R-PBGA-B107
Package Shape: RECTANGULAR
Terminal Form: BALL
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 85 Cel
Package Code: TQFP
Width: 8 mm
Memory Density: 268435456 bit
Mixed Memory Type: FLASH+PSRAM
Memory IC Type: MEMORY CIRCUIT
Minimum Operating Temperature: -25 Cel
Memory Width: 1
No. of Functions: 1
Package Equivalence Code: BGA107,9X12,32
Length: 10 mm
Maximum Access Time: 96 ns
No. of Words Code: 256M
Nominal Supply Voltage / Vsup (V): 1.8
Additional Features: PSEUDO SRAM IS ORGANIZED AS 64M X 1 BIT
Terminal Pitch: .8 mm
Maximum Supply Voltage (Vsup): 2 V
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