Micron Technology - PF38F5060M0Y1B0

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PF38F5060M0Y1B0 by Micron Technology

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Manufacturer Micron Technology
Manufacturer's Part Number PF38F5060M0Y1B0
Description MEMORY CIRCUIT; No. of Terminals: 105; Package Code: FBGA; Package Shape: RECTANGULAR; Surface Mount: YES; Maximum Standby Current: .00016 Amp;
Datasheet PF38F5060M0Y1B0 Datasheet
In Stock2,651
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Standby Current: .00016 Amp
Mixed Memory Type: FLASH+PSRAM
Sub-Category: Other Memory ICs
Surface Mount: YES
Memory IC Type: MEMORY CIRCUIT
No. of Terminals: 105
Qualification: Not Qualified
Package Equivalence Code: BGA105,9X12,32
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, FINE PITCH
Maximum Access Time: 96 ns
JESD-30 Code: R-PBGA-B105
Package Shape: RECTANGULAR
Terminal Form: BALL
Nominal Supply Voltage / Vsup (V): 1.8
Package Code: FBGA
Terminal Pitch: .8 mm
Power Supplies (V): 1.8
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