Micron Technology - PF38F5070M0Y0C0

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PF38F5070M0Y0C0 by Micron Technology

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Manufacturer Micron Technology
Manufacturer's Part Number PF38F5070M0Y0C0
Description MEMORY CIRCUIT; No. of Terminals: 107; Package Code: FBGA; Package Shape: RECTANGULAR; Package Equivalence Code: BGA107,9X12,32; Terminal Position: BOTTOM;
Datasheet PF38F5070M0Y0C0 Datasheet
In Stock1,158
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Standby Current: .00016 Amp
Mixed Memory Type: FLASH+PSRAM
Sub-Category: Other Memory ICs
Surface Mount: YES
Memory IC Type: MEMORY CIRCUIT
No. of Terminals: 107
Qualification: Not Qualified
Package Equivalence Code: BGA107,9X12,32
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, FINE PITCH
Maximum Access Time: 96 ns
JESD-30 Code: R-PBGA-B107
Package Shape: RECTANGULAR
Terminal Form: BALL
Nominal Supply Voltage / Vsup (V): 1.8
Package Code: FBGA
Terminal Pitch: .8 mm
Power Supplies (V): 1.8
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