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| Manufacturer | Micron Technology |
|---|---|
| Manufacturer's Part Number | PF38F5070M0Y3DG |
| Description | MEMORY CIRCUIT; No. of Terminals: 56; Package Code: TFQFP; Package Shape: SQUARE; Maximum Operating Temperature: 85 Cel; Minimum Supply Voltage (Vsup): 1.7 V; |
| Datasheet | PF38F5070M0Y3DG Datasheet |
| In Stock | 2,386 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Organization: | 512MX1 |
| Maximum Seated Height: | 1.2 mm |
| Minimum Supply Voltage (Vsup): | 1.7 V |
| Surface Mount: | YES |
| No. of Terminals: | 56 |
| No. of Words: | 536870912 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | FLATPACK, THIN PROFILE, FINE PITCH |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B56 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Operating Mode: | SYNCHRONOUS |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | TFQFP |
| Width: | 8 mm |
| Memory Density: | 536870912 bit |
| Mixed Memory Type: | FLASH+PSRAM |
| Memory IC Type: | MEMORY CIRCUIT |
| Minimum Operating Temperature: | -25 Cel |
| Memory Width: | 1 |
| No. of Functions: | 1 |
| Package Equivalence Code: | BGA56,10X14,20 |
| Length: | 8 mm |
| Maximum Access Time: | 70 ns |
| No. of Words Code: | 512M |
| Nominal Supply Voltage / Vsup (V): | 1.8 |
| Additional Features: | PSEUDO SRAM IS ORGANIZED AS 256M X 1 BIT |
| Terminal Pitch: | .5 mm |
| Maximum Supply Voltage (Vsup): | 2 V |
