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Manufacturer | Micron Technology |
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Manufacturer's Part Number | PH28F128W30BD70 |
Description | FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 60; Package Code: FBGA; Package Shape: RECTANGULAR; No. of Words Code: 8M; |
Datasheet | PH28F128W30BD70 Datasheet |
In Stock | 618 |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Maximum Standby Current: | .00007 Amp |
Organization: | 8MX16 |
Sub-Category: | Flash Memories |
Surface Mount: | YES |
Maximum Supply Current: | 22 mA |
Command User Interface: | YES |
No. of Terminals: | 60 |
No. of Words: | 8388608 words |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, FINE PITCH |
Technology: | CMOS |
JESD-30 Code: | R-PBGA-B60 |
No. of Sectors/Size: | 8, 255 |
Package Shape: | RECTANGULAR |
Terminal Form: | BALL |
Maximum Operating Temperature: | 85 Cel |
Package Code: | FBGA |
Boot Block: | BOTTOM |
Memory Density: | 134217728 bit |
Sector Size (Words): | 4K,32K |
Toggle Bit: | NO |
Memory IC Type: | FLASH |
Minimum Operating Temperature: | -40 Cel |
Memory Width: | 16 |
Page Size (words): | 4 |
Type: | NOR TYPE |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA60,9X10,30 |
Common Flash Interface: | YES |
Maximum Access Time: | 70 ns |
No. of Words Code: | 8M |
Parallel or Serial: | PARALLEL |
Terminal Pitch: | .75 mm |
Temperature Grade: | INDUSTRIAL |
Data Polling: | NO |
Power Supplies (V): | 1.8,3 |