Micron Technology - QB25F640S33B8

QB25F640S33B8 by Micron Technology

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Manufacturer Micron Technology
Manufacturer's Part Number QB25F640S33B8
Description FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel;
Datasheet QB25F640S33B8 Datasheet
In Stock683
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Standby Current: .00007 Amp
Organization: 8MX8
Sub-Category: Flash Memories
Surface Mount: YES
Maximum Supply Current: 45 mA
No. of Terminals: 16
Maximum Clock Frequency (fCLK): 68 MHz
No. of Words: 8388608 words
Terminal Position: DUAL
Package Style (Meter): SMALL OUTLINE
Write Protection: HARDWARE/SOFTWARE
Technology: CMOS
JESD-30 Code: R-PDSO-G16
Package Shape: RECTANGULAR
Terminal Form: GULL WING
Maximum Operating Temperature: 85 Cel
Endurance: 100000 Write/Erase Cycles
Package Code: SOP
Boot Block: BOTTOM
Serial Bus Type: SPI
Memory Density: 67108864 bit
Memory IC Type: FLASH
Minimum Operating Temperature: -40 Cel
Memory Width: 8
Type: NOR TYPE
Qualification: Not Qualified
Package Equivalence Code: SOP16,.4
No. of Words Code: 8M
Parallel or Serial: SERIAL
Terminal Pitch: 1.27 mm
Temperature Grade: INDUSTRIAL
Power Supplies (V): 3/3.3
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